Back to News
research

Quasi-non-volatile capacitorless DRAM based on ultralow-leakage edge-contact MoS<sub>2</sub> transistors

Saifei Gou
Loading...
12 min read
0 likes
⚡ Quantum Brief
Chinese researchers developed a breakthrough edge-contact MoS₂ transistor with record-low leakage current (1.75 × 10⁻²⁰ A/µm), enabling quasi-non-volatile DRAM without capacitors. Published in January 2026, the work overcomes key 2D semiconductor scaling barriers. The team used an in-situ vacuum process—combining etching, plasma treatment, and metal deposition—to minimize interface defects, achieving both high on-state current and ultra-low off-state leakage in a single device. The resulting capacitorless 2T-DRAM demonstrates 5-bit memory accuracy, nanosecond write speeds, and near-non-volatile retention, rivaling traditional DRAM while eliminating refresh power demands. This advance addresses longstanding contact engineering challenges in 2D materials, particularly Fermi-level pinning, by leveraging edge contacts for ultimate scaling potential in post-Moore electronics. Funded by China’s National Key R&D Program, the technology could enable denser, lower-power memory for AI hardware and next-gen computing architectures.
AI Audio Summary
0:00 / 0:00
Click to play
generated-image (58).png
Quantum News · Media Library

Nature Materials (2026)Cite this article Two-dimensional semiconductors are emerging as crucial materials for the post-Moore era. However, the transition to industrial-scale applications is hindered by engineering challenges, including the contact engineering. Among different strategies, edge contact offers advantages of ultimate contact scaling and the elimination of Fermi level pinning, but struggles with co-optimization between on-state current, threshold voltage and off-state leakage current. Here we address these challenges by utilizing an in situ multistep process, in which etching, soft plasma treatment and metal deposition are performed sequentially within the same custom-designed high-vacuum chamber to minimize interface defects. This approach enables molybdenum disulfide (MoS2)-based edge-contact field-effect transistors exhibiting an ultralow leakage current of 1.75 × 10−20 A μm−1 at zero gate voltage and an enhanced on-state current. The optimized capacitorless two-transistor dynamic random-access memory (DRAM) achieves a quasi-non-volatile memory operation, 5-bit memory accuracy and nanosecond-level write speed, demonstrating the potential for two-dimensional semiconductor-based circuits and memory devices.This is a preview of subscription content, access via your institution Access Nature and 54 other Nature Portfolio journals Get Nature+, our best-value online-access subscription $32.99 / 30 days cancel any timeSubscribe to this journal Receive 12 print issues and online access $259.00 per yearonly $21.58 per issueBuy this articleUSD 39.95Prices may be subject to local taxes which are calculated during checkoutAll data needed to evaluate the findings of this study are available within the Article. Source data are available from Figshare via https://doi.org/10.6084/m9.figshare.30818588 (ref. 59). Source data are provided with this paper.Jiang, J., Wu, P., Liu, Y., Kong, J. & Peng, L.-M. Towards fab-compatible two-dimensional electronics. Nat. Rev. Electr. Eng. 2, 6–8 (2025).Article Google Scholar Wilson, L. et al. in 2021 IEEE International Roadmap for Devices and Systems Outbriefs 1–64 (IEEE, 2021).Kim, K. S. et al. The future of two-dimensional semiconductors beyond Moore’s law. Nat. Nanotechnol. 19, 895–906 (2024).Article CAS PubMed Google Scholar Fan, D. et al. Two-dimensional semiconductor integrated circuits operating at gigahertz frequencies. Nat. Electron. 6, 879–887 (2023).Article Google Scholar Das, S. et al. Transistors based on two-dimensional materials for future integrated circuits. Nat. Electron. 4, 786–799 (2021).Article CAS Google Scholar Wu, F. et al. Vertical MoS2 transistors with sub-1-nm gate lengths. Nature 603, 259–264 (2022).Article CAS PubMed Google Scholar Radisavljevic, B., Radenovic, A., Brivio, J., Giacometti, V. & Kis, A. Single-layer MoS2 transistors. Nat. Nanotechnol. 6, 147–150 (2011).Article CAS PubMed Google Scholar Chen, J. et al. Performance limits and advancements in single 2D transition metal dichalcogenide transistor. Nanomicro Lett. 16, 264 (2024).CAS PubMed PubMed Central Google Scholar Sheng, C. et al. Two-dimensional semiconductors: from device processing to circuit integration. Adv. Funct. Mater. 33, 2304778 (2023).Article CAS Google Scholar Wu, R. et al. Van der Waals epitaxial growth of atomically thin 2D metals on dangling-bond-free WSe2 and WS2. Adv. Funct. Mater. 29, 1806611 (2019).Article Google Scholar Liu, Y. et al. Promises and prospects of two-dimensional transistors. Nature 591, 43–53 (2021).Article CAS PubMed Google Scholar Zheng, Y., Gao, J., Han, C. & Chen, W. Ohmic contact engineering for two-dimensional materials. Cell. Rep. Phys. Sci. 2, 100298 (2021).Article CAS Google Scholar Zhou, Y. et al. Contact-engineered reconfigurable two-dimensional Schottky junction field-effect transistor with low leakage currents. Nat. Commun. 14, 4270 (2023).Article CAS PubMed PubMed Central Google Scholar Li, W. et al. Approaching the quantum limit in two-dimensional semiconductor contacts. Nature 613, 274–279 (2023).Article CAS PubMed Google Scholar Shen, P.-C. et al. Ultralow contact resistance between semimetal and monolayer semiconductors. Nature 593, 211–217 (2021).Article CAS PubMed Google Scholar Jiang, J., Xu, L., Qiu, C. & Peng, L.-M. Ballistic two-dimensional InSe transistors. Nature 616, 470–475 (2023).Article CAS PubMed Google Scholar Kappera, R. et al. Phase-engineered low-resistance contacts for ultrathin MoS2 transistors. Nat. Mater. 13, 1128–1134 (2014).Article CAS PubMed Google Scholar Zhao, P. et al. Air stable p-doping of WSe2 by covalent functionalization. ACS Nano 8, 10808–10814 (2014).Article CAS PubMed Google Scholar Chuang, H.-J. et al. Low-resistance 2D/2D ohmic contacts: a universal approach to high-performance WSe2, MoS2, and MoSe2 transistors. Nano Lett. 16, 1896–1902 (2016).Article CAS PubMed Google Scholar Liu, Y. et al. Approaching the Schottky–Mott limit in van der Waals metal–semiconductor junctions. Nature 557, 696–700 (2018).Article CAS PubMed Google Scholar Hu, Q. et al. True nonvolatile high-speed DRAM cells using tailored ultrathin IGZO. Adv. Mater. 35, 2210554 (2023).Article CAS Google Scholar Bhati, I., Chang, M. T., Chishti, Z., Lu, S. L. & Jacob, B. DRAM refresh mechanisms, penalties, and trade-offs. IEEE Trans. Comput. 65, 108–121 (2016).Article Google Scholar Wang, L. et al. One-dimensional electrical contact to a two-dimensional material. Science 342, 614–617 (2013).Article CAS PubMed Google Scholar Jain, A. et al. One-dimensional edge contacts to a monolayer semiconductor. Nano Lett. 19, 6914–6923 (2019).Article CAS PubMed Google Scholar Hung, T. Y. T. et al. Pinning-free edge contact monolayer MoS2 FET. In IEEE International Electron Devices Meeting 3.3.1–3.3.4 (IEEE, 2020).Chai, Y. et al. Making one-dimensional electrical contacts to molybdenum disulfide-based heterostructures through plasma etching. Phys. Status Solidi A 213, 1358–1364 (2016).Article CAS Google Scholar Cheng, Z. et al. Immunity to contact scaling in MoS2 transistors using in situ edge contacts. Nano Lett. 19, 5077–5085 (2019).Article CAS PubMed Google Scholar Yu, J. et al. Simultaneously ultrafast and robust two-dimensional flash memory devices based on phase-engineered edge contacts. Nat. Commun. 14, 5662 (2023).Article CAS PubMed PubMed Central Google Scholar Allain, A., Kang, J., Banerjee, K. & Kis, A. Electrical contacts to two-dimensional semiconductors. Nat. Mater. 14, 1195–1205 (2015).Article CAS PubMed Google Scholar Panarella, L. et al. Implications of side contact depth on the Schottky barrier of 2D field-effect transistors. J. Comput. Electron. 24, 32 (2024).Article Google Scholar Zhang, P. & Lin, F. Study of thickness-dependent mobility of MoS2FETs with HfO2 Encapsulation by edge contact. In IEEE International Conference on Integrated Circuits, Technologies and Applications 170–171 (IEEE, 2019).Yang, Z. et al. A Fermi-level-pinning-free 1D electrical contact at the intrinsic 2D MoS2–metal junction. Adv. Mater. 31, 1808231 (2019).Article Google Scholar Conde-Rubio, A., Liu, X., Boero, G. & Brugger, J. Edge-contact MoS2 transistors fabricated using thermal scanning probe lithography. ACS Appl. Mater. Interfaces 14, 42328–42336 (2022).Article CAS PubMed PubMed Central Google Scholar Xu, H. et al. High-performance wafer-scale MoS2 transistors toward practical application. Small 14, 1803465 (2018).Article Google Scholar Abidi, I. H. et al. Oxygen driven defect engineering of monolayer MoS2 for tunable electronic, optoelectronic, and electrochemical devices. Adv. Funct. Mater. 34, 2402402 (2024).Article CAS Google Scholar Zhang, C. et al. Correcting charged supercell defect calculations in low-dimensional semiconductors. Phys. Rev. B 108, 245305 (2023).Article CAS Google Scholar Kshirsagar, C. U. et al. Dynamic memory cells using MoS2 field-effect transistors demonstrating femtoampere leakage currents. ACS Nano 10, 8457–8464 (2016).Article CAS PubMed Google Scholar Shockley, W. & Read, W. T. Statistics of the recombinations of holes and electrons. Phys. Rev. 87, 835–842 (1952).Article CAS Google Scholar Sah, C.-T. & Shockley, W. Electron–hole recombination statistics in semiconductors through flaws with many charge conditions. Phys. Rev. 109, 1103–1115 (1958).Article CAS Google Scholar Huang, K., Rhys, A. & Mott, N. F. Theory of light absorption and non-radiative transitions in F-centres. Proc. R. Soc. A 204, 406–423 (1950).CAS Google Scholar Alkauskas, A., Yan, Q. & Van de Walle, C. G. First-principles theory of nonradiative carrier capture via multiphonon emission. Phys. Rev. B 90, 075202 (2014).Article CAS Google Scholar Huang, K. Lattice relaxation and multiphonon transitions. Contemp. Phys. 22, 599–612 (1981).Article CAS Google Scholar Turiansky, M. E., Alkauskas, A. & Van de Walle, C. G. Dimensionality effects on trap-assisted recombination: the Sommerfeld parameter. Phys. Condens. Matter 36, 195902 (2024).Article CAS Google Scholar Ma, J. et al. Top gate engineering of field-effect transistors based on wafer-scale two-dimensional semiconductors. J. Mater. Sci. Technol. 106, 243–248 (2022).Article CAS Google Scholar Belmonte, A. et al. Lowest IOFF 400s) DRAM cell paving the way towards low-power and high-density monolithic 3D DRAM. In IEEE International Electron Devices Meeting 28.2.1–28.2.4 (IEEE, 2020).Belmonte, A. et al. Tailoring IGZO-TFT architecture for capacitorless DRAM, demonstrating > 103s retention, >1011 cycles endurance and Lg scalability down to 14nm. In IEEE International Electron Devices Meeting 10.6.1–10.6.4 (IEEE, 2021).Duan, X. et al. Novel vertical channel-all-around (CAA) IGZO FETs for 2T0C DRAM with high density beyond 4F2 by monolithic stacking. In IEEE International Electron Devices Meeting 10.5.1–10.5.4 (IEEE, 2021).Zhao, Z. et al. Computational associative memory based on monolithically integrated metal-oxide thin film transistors for update-frequent search applications. In IEEE International Electron Devices Meeting 37.6.1–37.6.4 (IEEE, 2021).Ye, H. et al. Double-gate W-doped amorphous indium oxide transistors for monolithic 3D capacitorless gain cell eDRAM. In IEEE International Electron Devices Meeting 28.3.1–28.3.4 (IEEE, 2020).Hu, Q. et al. Capacitorless DRAM cells based on high-performance indium–tin–oxide transistors with record data retention and reduced write latency. IEEE Electron Device Lett. 44, 60–63 (2023).Article Google Scholar Kresse, G. & Furthmüller, J. Efficiency of ab-initio total energy calculations for metals and semiconductors using a plane-wave basis set. Comput. Mater. Sci. 6, 15–50 (1996).Article CAS Google Scholar Kresse, G. & Joubert, D. From ultrasoft pseudopotentials to the projector augmented-wave method. Phys. Rev. B 59, 1758–1775 (1999).Article CAS Google Scholar Perdew, J. P., Burke, K. & Ernzerhof, M. Generalized gradient approximation made simple. Phys. Rev. Lett. 77, 3865–3868 (1996).Article CAS PubMed Google Scholar Freysoldt, C. et al. First-principles calculations for point defects in solids. Rev. Mod. Phys. 86, 253–305 (2014).Article Google Scholar Lany, S. & Zunger, A. Assessment of correction methods for the band-gap problem and for finite-size effects in supercell defect calculations: case studies for ZnO and GaAs. Physical Review B 78, 235104 (2008).Article Google Scholar Wang, D. et al. Determination of formation and ionization energies of charged defects in two-dimensional materials. Phys. Rev. Lett. 114, 196801 (2015).Article PubMed Google Scholar Gou, S. et al. Research data supporting ‘Quasi-non-volatile capacitorless DRAM based on ultra-low leakage edge contact MoS2 transistor’. Figshare https://doi.org/10.6084/m9.figshare.30818588 (2025).Download referencesThis work was supported by the National Key Research and Development Program (grant 2021YFA1200500), the National Natural Science Foundation of China (grants 62374037, 12334005, 12174060 and 12404089), the Innovation Program of Shanghai Municipal Education Commission (grant 2021-01-07-00-07-E00077), the Science and Technology Commission of Shanghai Municipality (grant 23JC1401100) and the Shanghai Pilot Program for Basic Research—Fudan University 21TQ1400100 (grant 23TQ008). This work has been supported by the New Cornerstone Science Foundation through the XPLORER PRIZE.These authors contributed equally: Saifei Gou, Yuxuan Zhu, Zhejia Zhang, Menglin Huang, Jinshu Zhang.State Key Laboratory of Integrated Chip and Systems, School of Microelectronics, Fudan University, Shanghai, People’s Republic of ChinaSaifei Gou, Yuxuan Zhu, Zhejia Zhang, Menglin Huang, Jinshu Zhang, Xiangqi Dong, Mingrui Ao, Qicheng Sun, Zhenggang Cai, Yan Hu, Yufei Song, Jiahao Wang, Haojie Chen, Yuchen Tian, Xinliu He, Jieya Shang, Zhengjie Sun, Qihao Chen, Yang Liu, Shiyou Chen, Peng Zhou & Wenzhong BaoShenzhen Six Carbon Technology, Shenzhen, People’s Republic of ChinaZihan XuSchool of Information Science and Technology, Fudan University, Shanghai, People’s Republic of ChinaXiaofei Yue & Chunxiao CongShaoxin Laboratory, Shaoxing, People’s Republic of ChinaYin Wang, Xiaojun Tan, Peng Zhou & Wenzhong BaoFrontier Institute of Chip and System, Fudan University, Shanghai, People’s Republic of ChinaLiwei LiuSchool of Microelectronics, Shanghai University, Jiading, Shanghai, People’s Republic of ChinaMengjiao LiChangxin Memory Technologies, Hefei, People’s Republic of ChinaChen Yang, Hao Meng, Mingyuan Liu & Huihui LiShanghai AtomIC Technology, Shanghai, People’s Republic of ChinaWenzhong BaoSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarSearch author on:PubMed Google ScholarW.B., P.Z. and S.C. supervised the project. S.G., Y.Z., Z.Z. and J.Z. conceived the experiments. M.H. and S.C. performed the theoretical calculations. S.G., Y.Z., Z.Z., J.Z., X.D., M.A., Q.S., Y.H., Y.S., H.C., Y.T., X.H., J.W., Z.S., Q.C., Y.L. and J.S. fabricated the devices. S.G., Y.Z., Z.Z., Z.C. and J.Z. performed the electrical measurements. Z.X. conducted the growth of MoS2. X.Y. and C.C. performed the Raman and PL experiments. S.G., Y.Z., M.H., Z.Z. and J.Z. wrote the original article. W.B., P.Z., S.C., Y.W., L.L., X.T., M.L., C.Y., H.M., M.L. and H.L. revised the article. All authors discussed the results and commented on the manuscript.Correspondence to Shiyou Chen, Peng Zhou or Wenzhong Bao.The authors declare no competing interests.Nature Materials thanks Vita Pi-Ho Hu, Won Jong Yoo, Han Wang for their contribution to the peer review of this work.Publisher’s note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.Supplementary Figs. 1–25 and Supplementary Tables 1 and 2.Statistical Source DataStatistical Source DataStatistical Source DataStatistical Source DataSpringer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.Reprints and permissionsGou, S., Zhu, Y., Zhang, Z. et al. Quasi-non-volatile capacitorless DRAM based on ultralow-leakage edge-contact MoS2 transistors. Nat. Mater. (2026). https://doi.org/10.1038/s41563-025-02470-wDownload citationReceived: 26 January 2025Accepted: 15 December 2025Published: 14 January 2026Version of record: 14 January 2026DOI: https://doi.org/10.1038/s41563-025-02470-wAnyone you share the following link with will be able to read this content:Sorry, a shareable link is not currently available for this article. Provided by the Springer Nature SharedIt content-sharing initiative

Read Original

Source Information

Source: Nature Quantum Materials

Discussion

0 professional contributions

Sign in to join this professional discussion.

Be the first to add a constructive contribution.