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EU Allocates €50M ($59M USD) to SUPREME Consortium for Superconducting Quantum Industrialization

Quantum Computing Report
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A €50 million ($59M USD) EU-led initiative, matched by national funds, will accelerate superconducting quantum technology industrialization through the SUPREME consortium, coordinated by Finland’s VTT Technical Research Centre. The 3.5-year project targets TRL 6 and MRL 6 for superconducting quantum devices, focusing on 3D-integrated 200-qubit modules to validate scalability, stability, and manufacturing reproducibility. SUPREME will democratize quantum hardware development by offering Process Design Kits (PDKs) and shared pilot runs, lowering costs for SMEs and startups to prototype proprietary quantum chips. The 23-member consortium spans eight EU nations, uniting research giants (CEA, Fraunhofer), corporations (Infineon, IQM), and startups (Alice & Bob, QuantWare) to bridge academia and industrial-scale production. Aligned with the EU Quantum and Chips Acts, the effort aims to secure Europe’s technological sovereignty in quantum computing, sensing, and communication by standardizing fabrication processes.
EU Allocates €50M ($59M USD) to SUPREME Consortium for Superconducting Quantum Industrialization

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EU Allocates €50M ($59M USD) to SUPREME Consortium for Superconducting Quantum Industrialization The European Union has allocated €25 million ($29.5 million USD) to the SUPREME consortium, with an equivalent amount provided by national funding agencies for a total investment of €50 million ($59 million USD). Coordinated by VTT Technical Research Centre of Finland, the initiative is designed to industrialize superconducting quantum technologies over a three-and-a-half-year phase beginning in early 2026. The project is aligned with the European Quantum and European Chips Act objectives to establish domestic fabrication capabilities and technological sovereignty. The technical roadmap focuses on advancing superconducting quantum devices toward Technology Readiness Level (TRL) 6 and Manufacturing Readiness Level (MRL) 6. Research activities will validate processes for angle-evaporated junctions, etched junctions, and hybrid fabrication. A core objective is the demonstration of a 3D-integrated 200-qubit module, which is intended to benchmark stability, chip yield, and reproducibility in large-scale superconducting qubit architectures. To support the commercialization of quantum hardware, SUPREME will provide access to its fabrication infrastructure through Process Design Kits (PDKs) and shared pilot runs. These services are intended to enable SMEs and startups to develop proprietary quantum devices while reducing the financial burden of full wafer fabrication. The project aims to provide standardized design rules and validated process specifications to researchers and industrial end-users across the union. The consortium comprises 23 partners from eight Member States, including research organizations such as CEA (France), Fraunhofer (Germany), and TNO (Netherlands), alongside large enterprises like Infineon Technologies and IQM Quantum Computers. Participating small and medium enterprises include Alice & Bob, QuantWare, QphoX, and Qilimanjaro Quantum Tech. The collaborative framework is intended to bridge the gap between academic research and industrial-scale manufacturing for quantum computing, sensing, and communication. Read the official announcement from VTT here. February 2, 2026 Mohamed Abdel-Kareem2026-02-02T15:46:14-08:00 Leave A Comment Cancel replyComment Type in the text displayed above Δ This site uses Akismet to reduce spam. Learn how your comment data is processed.

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Source: Quantum Computing Report