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QuantumDiamonds Deploys First Asian Quantum Sensing System QD m.1 at Taiwan’s iST

Quantum Computing Report
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⚡ Quantum Brief
A Munich-based quantum sensing firm has deployed its QDm.1 system at Taiwan’s iST facility in Hsinchu, marking its first commercial installation in Asia. The system supports yield optimization for advanced semiconductor nodes. The QDm.1 uses Quantum Diamond Microscopy (QDM) with nitrogen-vacancy centers to enable non-destructive, micrometer-precision 3D imaging of current pathways in complex chips, including 2.5D/3D ICs and wide-bandgap materials like GaN and SiC. Targeting AI and memory applications, the technology allows engineers to analyze high-density interconnects without damaging devices, addressing growing chip complexity challenges in semiconductor manufacturing. Founded in 2022, the company—backed by €152 million under the European Chips Act—engages nine of the top ten global semiconductor manufacturers and is building a Munich production hub for quantum inspection tools. This deployment serves as a regional benchmark for Taiwan, Japan, and Korea, offering scalable failure analysis solutions for cutting-edge semiconductor supply chains.
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QuantumDiamonds Deploys First Asian Quantum Sensing System QD m.1 at Taiwan’s iST

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QuantumDiamonds Deploys First Asian Quantum Sensing System QD m.1 at Taiwan’s iST QuantumDiamonds GmbH, a Munich-based specialist in quantum sensing for semiconductor testing, has successfully deployed its QDm.1 system at the Integrated Service Technology (iST) facility in Hsinchu, Taiwan. This installation represents the company’s first commercial footprint in Asia and follows its recent expansion into the United States. The QDm.1 is now operational within iST’s failure analysis laboratory, situated in the center of Taiwan’s semiconductor manufacturing cluster, to support high-volume yield optimization for advanced technology nodes. The QDm.1 system utilizes patented Quantum Diamond Microscopy (QDM) to perform non-destructive, high-resolution 3D imaging of current pathways within complex semiconductor architectures. By leveraging nitrogen-vacancy (NV) centers in diamond, the technology maps electrical currents with micrometer precision. This capability is specifically designed to address failure analysis challenges in 2.5D and 3D integrated circuits, backside power delivery networks, and wide-bandgap materials such as Gallium Nitride (GaN) and Silicon Carbide (SiC). The system provides engineers with a method to interrogate high-density interconnects without damaging the underlying device, a critical requirement as chip complexity increases for AI and memory applications. Spun out of the Technical University of Munich in 2022, QuantumDiamonds is currently engaged with nine of the world’s ten largest semiconductor manufacturers. The company is backed by a €152 million investment, supported under the European Chips Act, to establish a production facility in Munich dedicated to quantum-based inspection hardware. The deployment at iST is intended to serve as a regional benchmark for the Taiwan, Japan, and Korea ecosystems, providing a scalable platform for failure analysis at the leading edge of the semiconductor supply chain. You can find the official press release regarding the Taiwan deployment here and refer to our previous coverage of the company’s first U.S. installation here. May 2, 2026 Mohamed Abdel-Kareem2026-05-02T17:26:42-07:00 Leave A Comment Cancel replyComment Type in the text displayed above Δ This site uses Akismet to reduce spam. Learn how your comment data is processed.

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Source: Quantum Computing Report