Lightmatter & GUC Partner to Redefine AI Scalability with CPO Solutions
Summarize this article with:
Lightmatter and Global Unichip Corp. (GUC) are joining forces on January 26, 2026, to deliver Co-Packaged Optics (CPO) solutions poised to redefine AI scalability for hyperscalers. The partnership will combine GUC’s advanced ASIC design with Lightmatter’s industry-leading Passage™ 3D CPO platform, tackling critical connectivity bottlenecks hindering the next generation of AI and High-Performance Computing. This collaboration aims to overcome the physical limitations of current chip I/O, substantially improving training time and token throughput for complex AI models. “The fundamental architecture of computers is changing…pairing their silicon expertise with our photonic interconnects provides the industry with a concrete path to escape the energy and performance traps of legacy signaling,” said Nick Harris, founder and CEO of Lightmatter, signaling a significant leap forward in AI infrastructure. Lightmatter & GUC Partnership for Co-Packaged Optics Solutions A strategic alliance between Lightmatter and Global Unichip Corp. (GUC) aims to resolve escalating bandwidth demands within artificial intelligence infrastructure, beginning January 26, 2026. The collaboration will integrate Lightmatter’s Passage™ 3D Co-Packaged Optics (CPO) platform with GUC’s advanced ASIC design and packaging capabilities, targeting hyperscale AI deployments. This isn’t simply incremental improvement; the companies are addressing fundamental limitations in current chip I/O, which restrict the scalability of AI and High-Performance Computing (HPC) workloads. Lightmatter’s Passage platform, utilizing silicon photonics, promises unprecedented bandwidth density and power efficiency for chip-to-chip communication—a critical upgrade over existing solutions hampered by “the shoreline” of the chip. “The world has hit a wall in per silicon area performance, the network is becoming the computer, and that network needs to run on light.” GUC’s expertise will be vital in incorporating Passage into advanced node chiplet workflows. Igor Elkanovich, CTO of GUC, emphasizes the customer benefit: “Integrating Lightmatter’s Passage CPO platform into our world-class ASIC designs allows us to bring to market a joint solution that fundamentally redefines AI interconnect.” Analyst Dr. Wei-Chung Lo of ITRI, Taiwan, adds, “Optical interconnect is no longer a luxury; it is a necessity for hyperscale AI to continue its exponential growth path,” highlighting the market’s maturation and the potential for scalable AI clusters.
Passage Platform Redefines AI Interconnect Performance Lightmatter and Global Unichip Corp. (GUC) are collaborating to commercialize a co-packaged optics (CPO) solution centered around Lightmatter’s Passage platform, aiming to resolve critical bottlenecks in AI infrastructure scalability. The integrated solution will utilize GUC’s advanced chiplet and packaging workflows to incorporate Passage, a silicon photonics-based system designed to dramatically improve bandwidth density and power efficiency for chip-to-chip communication between XPUs and switches. This advancement is crucial as existing interconnects are limited by the physical constraints—or “shoreline”—of the chip itself, hindering maximum bandwidth and scalability. The Passage platform promises to extend the scale-up domain of AI clusters beyond single racks, substantially reducing training times and increasing token throughput for complex foundation models. Industry Validation of CPO Necessity for Hyperscale AI The escalating demands of artificial intelligence are driving a fundamental shift in computer architecture, necessitating innovative interconnect solutions, and a new partnership between Lightmatter and Global Unichip Corp. (GUC) aims to deliver just that. The collaboration focuses on commercializing co-packaged optics (CPO) solutions, specifically leveraging Lightmatter’s Passage™ 3D CPO platform alongside GUC’s advanced ASIC design capabilities. The core issue lies in the ‘shoreline’ – the physical I/O limits of chips – which restrict bandwidth and scalability. The combined expertise tackles challenges in areas like thermal management and signal integrity, promising a robust and scalable CPO platform for large-scale AI deployment. Optical interconnect is no longer a luxury; it is a necessity for hyperscale AI to continue its exponential growth path. Dr. Wei-Chung Lo, Deputy General Director at Electronic & Optoelectronic System Research Laboratories (EOSL) of Industrial Technology Research Institute (ITRI), Taiwan Source: https://lightmatter.co/press-release/lightmatter-and-guc-partner-to-produce-co-packaged-optics-cpo-solutions-for-ai-hyperscalers/ Tags: Quantum News As the Official Quantum Dog (or hound) by role is to dig out the latest nuggets of quantum goodness. There is so much happening right now in the field of technology, whether AI or the march of robots. But Quantum occupies a special space. Quite literally a special space. A Hilbert space infact, haha! Here I try to provide some of the news that might be considered breaking news in the Quantum Computing space. Latest Posts by Quantum News: La Luce Cristallina Launches Scalable Oxide Pseudo-Substrate for Quantum & RF Applications January 27, 2026 C12 Advances Scalable Quantum Computing with Classiq’s Software Platform January 27, 2026 SEALSQ’s Quantum Highway: Building Trust in Silicon for Global Connectivity January 27, 2026